ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,371, issued on Oct. 20, was assigned to ASUSTek COMPUTER INC. (Taipei City, Taiwan). "Heat dissipation module" was invented by Po-Ting Chen... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,372, issued on Oct. 20. "Shieldable circuit board structure" was invented by Chen-Wei Su (Taipei City, Taiwan). According to the abstract*... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,373, issued on Oct. 20, was assigned to Infineon Technologies AG (Neubiberg, Germany). "Semiconductor module and method for fabricating a s... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,374, issued on Oct. 20, was assigned to HONGQISHENG PRECISION ELECTRONICS (QINHUANGDAO) Co. LTD. (Hebei Province, China), AVARY HOLDING (SHE... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,375, issued on Oct. 20, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board" was invented by... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,376, issued on Oct. 20, was assigned to LOTTE ENERGY MATERIALS CORPORATON (Jeollabuk-do, South Korea). "Surface-treated copper foil with he... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,377, issued on Oct. 20, was assigned to SAMSUNG ELECTRO-MECHANICS Co. LTD. (Suwon-si, South Korea). "Printed circuit board and method of ma... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,378, issued on Oct. 20, was assigned to IBIDEN Co. Ltd. (Ogaki, Japan). "Wiring substrate having multiple build-up parts" was invented by M... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,379, issued on Oct. 20, was assigned to TOPPAN HOLDINGS INC. (Tokyo). "Glass substrate, through-electrode, multilayer wiring substrate, and... Read More
ALEXANDRIA, Va., Oct. 21 -- United States Patent no. 12,772,380, issued on Oct. 20, was assigned to HELLA GmbH & Co. KGaA (Lippstadt, Germany). "Circuit system and method for radar, lidar, or camera ... Read More